JPH052278Y2 - - Google Patents
Info
- Publication number
- JPH052278Y2 JPH052278Y2 JP9183287U JP9183287U JPH052278Y2 JP H052278 Y2 JPH052278 Y2 JP H052278Y2 JP 9183287 U JP9183287 U JP 9183287U JP 9183287 U JP9183287 U JP 9183287U JP H052278 Y2 JPH052278 Y2 JP H052278Y2
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- wafer
- semiconductor wafer
- periphery
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9183287U JPH052278Y2 (en]) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9183287U JPH052278Y2 (en]) | 1987-06-15 | 1987-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63201047U JPS63201047U (en]) | 1988-12-26 |
| JPH052278Y2 true JPH052278Y2 (en]) | 1993-01-20 |
Family
ID=30952974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9183287U Expired - Lifetime JPH052278Y2 (en]) | 1987-06-15 | 1987-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH052278Y2 (en]) |
-
1987
- 1987-06-15 JP JP9183287U patent/JPH052278Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63201047U (en]) | 1988-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2719855B2 (ja) | ウエーハ外周の鏡面面取り装置 | |
| JP2613504B2 (ja) | ウエーハのノッチ部面取り方法および装置 | |
| US4227347A (en) | Two motor drive for a wafer processing machine | |
| JP2571487B2 (ja) | 薄円板状ワークのスクラバー洗浄装置 | |
| JPH052278Y2 (en]) | ||
| JPH1133888A (ja) | ウェーハの鏡面面取り装置 | |
| JP2849904B2 (ja) | ワークの面取加工装置、外周加工装置及び面取・外周加工装置 | |
| JP2000158304A (ja) | 平面研削方法及び鏡面研磨方法 | |
| KR102047717B1 (ko) | 블레이드의 드레싱 기구 및 그 기구를 구비한 절삭 장치 및 그 기구를 사용한 블레이드의 드레싱 방법 | |
| JP2002224955A (ja) | 研削盤 | |
| JP2613081B2 (ja) | ウエハ外周部の鏡面研磨方法 | |
| JPS6225319Y2 (en]) | ||
| JPH06104228A (ja) | 半導体ウェーハのノッチ部のアール面取り方法及び装置 | |
| JPH1142540A (ja) | 半導体ウェーハの加工方法及びその装置 | |
| JP2004327466A (ja) | ウェーハ上面外周研磨装置 | |
| JP3584058B2 (ja) | ウェーハノッチ部の鏡面研摩方法およびその装置 | |
| JPH1133887A (ja) | 半導体ウェーハの研削方法及びその装置 | |
| JPH10328989A (ja) | ウエハエッジの鏡面研磨方法及び装置 | |
| JP2000176805A (ja) | 半導体ウェーハの面取り装置 | |
| JP2005153129A (ja) | ノッチ付ウェーハのノッチ部の面取り方法 | |
| JPH01268032A (ja) | ウエハ研磨方法および装置 | |
| JPS629859A (ja) | ボ−ル研削、研磨方法 | |
| JPH1190802A (ja) | ウェーハの面取り面研磨方法および面取り面研磨装置 | |
| JPH0115363B2 (en]) | ||
| JP2002222778A (ja) | 半導体装置の製造装置及びその製造方法 |